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What does TVSOP stand for?

TVSOP stands for Thin Very Small Outline Packages

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BCC: Bump Chip Carrier BGA: Ball Grid Array; BGA graphic BQFP: Bumpered Quad Flat Pack CABGA/SSBGA: Chip Array/Small Scale Ball Grid Array CBGA: Ceramic Ball Grid Array CCGA: Ceramic Column Grid Array [A column of solder] CERPACK: Ceramic Package CFP: Ceramic Flat Pack CGA: Column Grid Array CLCC: Ceramic Leadless Chip Carrier Packages [CLCC BJT Graphic] CLGA: Ceramic Land Grid Array [an LGA package] CQFP: Ceramic Quad Flat Pack, [CQFP Graphic] CQGP: Ceramic Quad [Gold Plating] CSBGA: Cavity Down BGA CSOP: Ceramic Small Outline Package CSP BGA: Chip Scale Package BGA TBD: Ceramic Lead-Less Chip Carrier DBS: DIL Bent SIL [In-line package with bent leads forming 2 rows] DFN: Dual Flat Pack, No Lead DLCC: Dual Lead-Less Chip Carrier (Ceramic) DLCC Graphic DMP: Dual In-line Mini Molded Package DQFN: Depopulated Quad Flat-pack; No-leads EPTSSOP: Thin Shrink Small Outline Exposed Pad Plastic Packages ETQFP: Extra Thin Quad Flat Package FBGA: Fine-pitch Ball Grid Array FCBGA: Flipchip BGA FCPBGA: Flip Chip Plastic BGA FFP: Flip-chip Fine Package FleXBGA: Flexible Ball Grid Array FLP: Flat Lead Package fpBGA: Fine Pitch Ball Grid Array HBCC: Heatsink Bottom Chip Carrier HBGA: High Performance Ball Grid Array [higher heat dissipation] HDIP: Heat-dissipating Dual In-line Package [appears the same as a standard DIP] HSBGA: Heat Slug Ball Grid Array [copper slug added to reduce thermal resistance] HSOP: Heatsink Small Outline Package HTSSOP: Heatsink Thin Shrink Small Outline Package HUQFN: Heatsink Ultra-thin Quad Flat-pack; No-leads HVQFN: Heatsink Very-thin Quad Flat-pack; No-leads HVSON: Heatsink Very-thin Small Outline; No-leads HWQFN: Heatsink Very-Very-thin Quad Flat-pack; No-leads HWSON: Heatsink Very-Very-thin Small Outline package; No leads HXQFN: Heatsink eXtremely-thin Quad Flat-pack; No-leads HXSON: Heatsink eXtremely Small Outline Package; No leads JDIP: J-Leaded Dual In-Line J-Lead DIP Picture JLCC: J-Leaded Chip Carrier (Ceramic) J-Lead Picture LBGA: Low-Profile Ball Grid Array LCC: Leaded Chip Carrier LCC Graphic LCC: Leaded Chip Carrier Un-formed LCC Graphic LCCC: Leaded Ceramic Chip Carrier; LCGA: Low-Profile Ball Grid Array; LFBGA: Low-Profile, Fine-Pitch Ball Grid Array LGA: Land Grid Array LGA Graphic [Pins located on Mother board, not the device] LLCC: Leadless Chip Carrier LLCC Graphic LQFP: Low-profile Quad Flat pack MCMBGA: Multi Chip Module Ball Grid Array MCMCABGA: Multi Chip Module-Chip Array Ball Grid Array MLCC: Micro Leadframe Chip Carrier MLP: Micro Lead-frame Package MLP graphic MQFP: Metric Quad Flat Pack [high pin count QFP] MSOP: Mini Small Outline Plastic Packages OBGA: Organic Ball Grid Array ODFN: Optical Dual Flat No-Lead Plastic Package PBGA: Plastic Ball Grid Array, PBGA graphic PLCC: Plastic Leaded Chip Carrier POS: Package on Substrate PQFD: Plastic Quad Flat -- PQFP: Plastic Quad Flat Pack PSOP: Plastic Small-Outline Package PSOP graphic QFN: Quad Flat No-Lead QFP: Quad Flat pack QFP Graphics QSOP: Quarter Size Outline Package SBGA: Super BGA - above 500 Pin count [Cavity down die] SDMP: Shrink Dual In-line Mini Molded Package SO Flat Pack: Small Outline Flat Pack IC SOIC: Small Outline IC SOJ: Small-Outline Package [J-Lead], SOJ SOLIC: Small Outline Large Integrated Circuit (Gull-Wing Lead Wide Body) SON: Small-Outline No-leads [leadless package] SOP: Small Out-line Package SSOP: Shrink Small-Outline Package SOT: Small Outline Transistor Plastic Package [SOT-23 Graphic] TBGA: Tape Ball Grid Array [Cavity-down thermally enhanced Flip Chip] TBGA: Thin Ball Grid Array TDFN: Thin Dual Flat No-Lead Plastic Package TEPBGA: Thermally Enhanced Plastic Ball Grid Array TFBGA: Thin profile Fine-pitch Ball Grid Array TQFN: Thin Quad Flat No-Lead Plastic Package TQFP: Thin Quad Flat Pack TQFP Graphic TSOP: Thin Small-Outline Package TSSOP: Thin Shrink Small-Outline Package TSOT: Thin Small Outline Transistor Plastic Package TVSOP: Thin Very Small-Outline Package.
BCC: Bump Chip Carrier BGA: Ball Grid Array; BGA graphic BQFP: Bumpered Quad Flat Pack CABGA/SSBGA: Chip Array/Small Scale Ball Grid Array CBGA: Ceramic Ball Grid Array CFP: Ceramic Flat Pack CLGA: Ceramic Land Grid Array [see LGA] CPGA: Ceramic Pin Grid Array, CPGA Graphic CQFP: Ceramic Quad Flat Pack, CQFP Graphic TBD: Ceramic Lead-Less Chip Carrier DFN: Dual Flat Pack, No Lead DLCC: Dual Lead-Less Chip Carrier (Ceramic) ETQFP: Extra Thin Quad Flat Package FBGA: Fine-pitch Ball Grid Array fpBGA: Fine Pitch Ball Grid Array HSBGA: Heat Slug Ball Grid Array JLCC: J-Leaded Chip Carrier (Ceramic) J-Lead Picture LBGA: Low-Profile Ball Grid Array LCC: Leaded Chip Carrier LCC Graphic LCC: Leaded Chip Carrier Un-formed LCC Graphic LCCC: Leaded Ceramic Chip Carrier; LFBGA: Low-Profile, Fine-Pitch Ball Grid Array LGA: Land Grid Array, LGA uP [Pins are on the Motherboard, not the socket] LLCC: Leadless Leaded Chip Carrier LLCC Graphic LQFP: Low Profile Quad Flat Package MCMBGA: Multi Chip Module Ball Grid Array MCMCABGA: Multi Chip Module-Chip Array Ball Grid Array MLCC: Micro Lead-frame Chip Carrier PBGA: Plastic Ball Grid Array PLCC: Plastic Leaded Chip Carrier PQFD: Plastic Quad Flat Pack PQFP: Plastic Quad Flat Pack PSOP: Plastic Small-Outline Package PSOP graphic QFP: Quad Flatpack QFP Graphics QSOP: Quarter Size Outline Package [Quarter Pitch Small Outline Package] SBGA: Super BGA - above 500 Pin count SOIC: Small Outline IC SO Flat Pack: Small Outline Flat Pack IC SOJ: Small-Outline Package [J-Lead]; J-Lead Picture SOP: Small-Outline Package; SOP IC, Socket SSOP: Shrink Small-Outline Package TBGA: Thin Ball Grid Array TQFP: Thin Quad Flat Pack TQFP Graphic TSOP: Thin Small-Outline Package TSSOP: Thin Shrink Small-Outline Package TVSOP: Thin Very Small-Outline Package.