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What does CFF stand for?

CFF stands for Conductive Filament Formation


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Samples in periodicals archive:

Conductive anodic filament (CAF) formation: an historic perspective Laura J. Turbini Purpose – Conductive anodic filament (CAF) is a failure mode in printed wiring boards (PWBS), which occurs under high humility and high voltage gradient conditions. This paper aims to review the history of CAF from its identification in the 1970s to the statistical analysis of its failure mode and the factors that enhance its formation.
In this paper the preliminary results of a study to characterize the conductive filament formation (often called metal migration) of woven fabric printed wiring boards with respect to resin material, board surface coating, applied bias, geometry of the electrodes and spacing between the electrodes are presented. The experiments were accelerated life tests at controlled temperature-humidity-voltage conditions.
The principal advantages of using E-glass fibers include high strength, high chemical resistance, and excellent insulating properties at reasonable cost. Although most fibers are solid, hollow fibers can be produced if there is insufficient process control during the manufacture of E-glass fibers. This creates a potential reliability problem in laminates since hollow fibers provide a path for conductive filament formation.
Conductive Anodic Filament (CAF) formation is a well-studied phenomenon that is driven by chemical, humidity, voltage, and mechanical means. It is characterized by a sudden loss of insulation resistance that happens internally in the PCB. CAF dendrites can form between adjacent plated through holes (PTH), or between a plated through hole and a line on the PCB. Plating chemistry, material consistency, damage from multiple soldering steps, and excessive voltages (beyond designed voltages) accelerate the onset of CAF.